FPC Manufacture Capabilities

FPC Manufacture Capabilities

ItemStandardAdvancedComment
MaterialFCCL(adhesive)Shengyi SF305: PI=0.5mil&1mil&2mil; Cu=0.33oz/0.5oz/1oz/
FCCL(adhesiveless)Panasonic R-F775: PI=1mil&2mil&3mil; Cu=0.5oz/1ozPI=3mil Cu=2oz
Taiflex MHK: PI=1mil&2mil; Cu=0.33oz/0.5oz/1oz

DuPont Pyralux AP: PI=1mil&2mil&3mil; Cu=0.5oz/1ozPI=4mil Cu=2oz
CoverlayShengyi SF305C: 0515 &0525 &1025 &2030/
Taiflex FHK:1025& 2035/
AdhesiveTaiflex BT: AD=10um &25um &40um/
PI stiffenerTaiflex MHK: PI=3mil &5mil &7mil &9mil/
3M9077& 6677 & 9058/
othersDesign softwareCAM350&PROTEL&PAD&POWERPCB&GENESIS&AUTOCAD&ORCAD/
Gerber formatRS-274-D ,RS-274-X/
Drill formatEXCELLON Format/
Layer1--45--10
Board thickness (without stiffener)0.05--0.5mm0.5--0.9mm
Tolerance of single layer±0.03mm±0.03mmwithout stiffener
Tolerance of double-layer ( 0.3mm)±0.03mm±0.03mmwithout stiffener
Tolerance of multi-layer (<  0.3mm)±0.03mm±0.03mmwithout stiffener
Tolerance of multi-layer (0.3mm-0.9mm)±0.05mm±10%without stiffener
Tolerance of board thickness (including PI stiffener)±0.05mm±10%
Tolerance of board thickness (including FR4 stiffener)±0.1mm±10%
Min. board size5*10mm(without bridge);10*10mm(with bridge)4*8mm(without bridge);8*8mm(with bridge)
Max. board size9 * 14 inch9 * 28 inch(PI1mil)
impedance control toleranceSingle-ended:±5Ω(50Ω)  ±10%(>50Ω)Single-ended:±3Ω(50Ω)  ±8%(>50Ω)
Differential:±5Ω(50Ω)  ±10%(>50Ω)Differential:±4Ω(50Ω)    ±8%(>50Ω)
Min. coverlay bridge8mil/
Min. bend radius single layer3--6 times of board thickness/
Min. bend radius double- layer6--10 times of board thickness/
Min. bend radius multi- layer10--15 times of board thickness/
Min. dynamic bend radius 20--40 times of board thickness/single layer
Inner layerMin.  line width/spacing (12/18um copper)3/3.2mil(loop lines 6/6.2mil)2.8/2.7mil(loop lines 5/5.2mil)
Min.  line width/spacing (35um copper)4/4mil(loop lines 8/8mil)3.5/3.5mil(loop lines 7/7mil)
Min.  line width/spacing (70um copper)6/6.5mil(loop lines 10/10.5mil)5/6mil(loop lines 9/9.5mil)
Max. copper thickness2oz3oz
Outer layerMin.  line width/spacing (18um copper)3/3.2mil(loop lines 6/6mil)2.8/2.7mil(loop lines 5.5/5.5mil)
Min.  line width/spacing (35um copper)4/4.5mil(loop lines 8/8.5mil)3.5/3.5mil(loop lines 7.5/7.5mil)
Min.  line width/spacing (70um copper)6/7mil(loop lines 10/11mil)5.5/8.5mil(loop lines 9.5/10mil)
Min.  line width/spacing (105um copper)10/13mil(loop lines 12/15mil)9.5/12.5mil(loop lines 11.5/14.5mil)
Max. finished copper thickness3oz5oz
DrillingMin. distance between via and conductors6mil(< 4 layers)5mil(< 4 layers)
8mil( 4--6 layers)7mil( 4--6 layers)
12mil( 7--8 layers)10mil(7--8 layers)
Min. mechanical drill hole6mil4mil
Solder mask&silk screenSolder mask colorgreen /
Min. solder dam(base copper  1oz )4mil(green),8mil(solder dam on the large copper)/
Min. clearance3 mil (prat for 2.5mil)/
Silk colorWhite,Yellow/
Surface treatmentSurface treatmentHASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Soft gold,Hard gold,Immersion silver and OSPImmersion tin
Mixed surface treatmentENIG+0SP; ENIG+G/F/
Gold thickness (ENIG)0.05--0.1um/
Nickel thickness(ENIG)3--6um/
Gold thickness (ENEPIG)0.05--0.1um/
Palladium thickness (ENEPIG)0.05--0.15um/
Nickel thickness(ENEPIG)3--6um/
Electrolytic Nickel thickness3--6um/
Electrolytic Gold thickness0.05--0.1um/
Hard gold thcikness(including lead)0.1--1.5um/
OSP thickness0.1--0.3um/
Immersion silver thickness0.2--0.4um/
RoutingLaser accuracy±0.05mm/
Punch accuracy±0.05mm -- ±0.15mm/